RS-BY0718AM750
Item | Description |
Mode |
RS-BY0718AM750 |
Chip |
Impinj M750 |
Frequency |
UHF(860 ~ 960 MHz) |
Standard |
EPC Class 1 Gen 2; ISO/IEC 18000-6C |
Antenna size |
50.1 × 30.1 mm |
Label size |
54 × 34 mm |
Label pitch |
37.193mm |
PET width |
58 mm |
Application | Shipping labels, Clothing listed, Small volume of drugs |
Dry Inlay Dimension
Roll Out Diagram
Layer Structure
Manufacture Process
Company Profile
HY-Link is a professional RFID inlay and label manufacturer since 2003, with
current capacity 3Millions daily and reach 6Billions annually in plan.
The world class facility equipped top brands’ machines from Muehlbauer flip-chip bonding & converting.
As a RAIN member, HY-Link aims the top player of independent inlay assembly hourse serving global market. Constant investment will benefit all partners reliable growth.
Located in Jingjiang China with 2 hours’ drive to Shanghai. With a rich experienced semi-conduction management team over 100 employees.
Attractive price, Super-fast shipping, Professional service and strategic partnership makes multi-wins!
The world class facility equipped top brands’ machines from Muehlbauer flip-chip bonding & converting.
As a RAIN member, HY-Link aims the top player of independent inlay assembly hourse serving global market. Constant investment will benefit all partners reliable growth.
Located in Jingjiang China with 2 hours’ drive to Shanghai. With a rich experienced semi-conduction management team over 100 employees.
Attractive price, Super-fast shipping, Professional service and strategic partnership makes multi-wins!
Certificate
Manufacture
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