RS-HYRZN4801HEC-3 Label
Item | Description |
Mode |
RS-HYRZN4801HEC-3 |
Chip |
Alien Higgs EC |
Frequency |
UHF(860 ~ 960 MHz) |
Standard |
EPC Class 1 Gen 2; ISO/IEC 18000-6C |
Label size |
73 × 18 mm |
Antenna size |
70 × 15 mm |
Label pitch |
22.225 mm |
Release paper width |
80 mm |
Application | Liquid Packaging Management, Supply Chain, Logistics Management |
Label Dimension
Roll Out Diagram
Layer Structure
Manufacture Process
Company Profile
HY-Link is a professional RFID inlay and label manufacturer since 2003, with
current capacity 3Millions daily and reach 6Billions annually in plan.
The world class facility equipped top brands’ machines from Muehlbauer flip-chip bonding & converting.
As a RAIN member, HY-Link aims the top player of independent inlay assembly hourse serving global market. Constant investment will benefit all partners reliable growth.
Located in Jingjiang China with 2 hours’ drive to Shanghai. With a rich experienced semi-conduction management team over 100 employees.
Attractive price, Super-fast shipping, Professional service and strategic partnership makes multi-wins!
The world class facility equipped top brands’ machines from Muehlbauer flip-chip bonding & converting.
As a RAIN member, HY-Link aims the top player of independent inlay assembly hourse serving global market. Constant investment will benefit all partners reliable growth.
Located in Jingjiang China with 2 hours’ drive to Shanghai. With a rich experienced semi-conduction management team over 100 employees.
Attractive price, Super-fast shipping, Professional service and strategic partnership makes multi-wins!
Certificate
Manufacture
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